| Autor: |
Rickert, Peter, Krenik, William |
| Předmět: |
|
| Zdroj: |
IEEE Design & Test of Computers; May/Jun2006, Vol. 23 Issue 3, p188-195, 8p, 5 Diagrams, 1 Chart |
| Abstrakt: |
The article talks about the three primary approaches to minimize cellular component cost, which are systems on a chip (SoC) integration, system-in-package (SiP) integration, and package-on-package (PoP) integration. The trade-offs among the three systems are investigated. More information is given in the article. |
| Databáze: |
Complementary Index |
| Externí odkaz: |
|
