| Abstrakt: |
This paper reports on progress on the feasibility of fabricating molds for electroplating of medium-to-high aspect ratio structures (up to 5) using SPR 220-7 positive photoresist, commercialized by Shipley [1, 2]. We used this photoresist as an alternative to SU-8 negative epoxy-based photoresist, which is very difficult to process and remove after electroplating [3, 4]. SPR 220-7 is easy to work with and can be used as a sacrificial layer if removed after processing. A single layer of SPR 220-7 was deposited by spin coating up to 18 µm thickness. Thicker layers (34–54 µm) can be achieved with multi-layer coating/baking steps using a manual spin coater and oven. The motivation of this work is to realize micromachined high-density current-carrying wires for atom guides [5, 6]. However, the process can be used for a variety of applications such as on-chip inductors and microtransformers. [ABSTRACT FROM AUTHOR] |
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