Autor:	Liu, Christianto C., Ganusov, Ilya, Burtscher, Martin, Tiwari, Sandip
Předmět:	INTEGRATED circuit design COMPUTER simulation of integrated circuits MICROELECTRONICS REDUCED instruction set computers MICROPROCESSORS MICROTECHNOLOGY INTEGRATED circuits
Zdroj:	IEEE Design & Test of Computers; Nov/Dec2005, Vol. 22 Issue 6, p556-564, 9p, 4 Black and White Photographs, 4 Graphs
Abstrakt:	Examines how third dimensional integrated circuits technology can improve interactions between processor and memory. Ability of third dimensional technology to bridge the processor-memory performance gap; Need of third dimensional designs to take advantage of the increased device density and the low-latency, high-bandwidth interconnections; Advantages and benefits in using logic technology.
Databáze:	Complementary Index
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