| Autor: |
Garg, Vivek, Stogner, Darrell J., Ulmer, Craig, Schimmel, David E., Dislis, Chryssa, Yalamanchili, Sudhakar, Wills, D. Scott |
| Předmět: |
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| Zdroj: |
IEEE Transactions on Components, Packaging & Manufacturing Technology, Part B; Aug97, Vol. 20 Issue 3, p308, 12p, 10 Black and White Photographs, 5 Diagrams, 5 Graphs |
| Abstrakt: |
Presents a study which explores early analysis of the complex relationships between system structures and the active and packaging materials from which they are implemented. Methodology used to conduct the study; Discussion based on the results of the study. |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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