| Autor: |
Gostein, M., Maznev, A. A., Mazurenko, A., Tower, J. |
| Předmět: |
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| Zdroj: |
AIP Conference Proceedings; 2005, Vol. 788 Issue 1, p496-500, 5p |
| Abstrakt: |
We review recent advances in the application of laser-induced surface acoustic wave metrology to issues in copper/low-k interconnect development and manufacturing. We illustrate how the metrology technique can be used to measure copper thickness uniformity on a range of features from solid pads to arrays of lines, focusing on specific processing issues in copper electrochemical deposition (ECD) and chemical-mechanical polishing (CMP). In addition, we review recent developments in surface wave metrology for the characterization of low-k dielectric elastic modulus, including the ability to measure within-wafer uniformity of elastic modulus and to characterize porous, anisotropic films. © 2005 American Institute of Physics [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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