Low Resistivity Metallic Films by Thermal Atomic Layer Deposition for High Aspect-Ratio Interconnects.
| Autor: | Weimer, Matthew, Stateikina, Irina, Harris, Sara, Lindblad, Dane, Guilmain, Marc, Gaudreau-Miron, Xavier, Dameron, Arrelaine A |
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| Zdroj: | ECS Meeting Abstracts; 2024, Vol. MA2024 Issue 2, p2214-2214, 1p |
| Databáze: | Complementary Index |
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