| Autor: |
Zhang, Cheng, Ning, Wenyu, Nan, Ding, Hao, Jiangtao, Shi, Weiliang, Yang, Yang, Duan, Fei, Jin, Wenbo, Liu, Lei, Zhao, Danyang |
| Zdroj: |
Polymers (20734360); Dec2024, Vol. 16 Issue 23, p3320, 18p |
| Abstrakt: |
Microfluidic devices offer promising solutions for automating various biological and chemical procedures. Epoxy resin, known for its excellent mechanical properties, chemical resistance, and thermal stability, is widely used in high-performance microfluidic devices. However, the poor printability of epoxy has limited its application in 3D printing technologies for fabricating epoxy-based microfluidic devices. In this study, fumed silica is introduced into epoxy resin to formulate a yield-stress fluid suspension as a support bath for embedded 3D printing (e-3DP). The study demonstrates that increasing the fumed silica concentration from 3.0% to 9.0% (w/v) enhances the yield stress from 9.46 Pa to 56.41 Pa, the compressive modulus from 19.79 MPa to 36.34 MPa, and the fracture strength from 148.16 MPa to 168.78 MPa, while reducing the thixotropic time from 6.58 s to 1.32 s, albeit with a 61.3% decrease in the transparency ratio. The 6.0% (w/v) fumed silica–epoxy suspension is selected based on a balance between yield stress, transparency, and mechanical performance, enabling high-fidelity filament formation. Two representative microfluidic devices are successfully fabricated, demonstrating the feasibility of a fumed silica–epoxy suspension for the customizable e-3DP of epoxy-based microfluidic devices. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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