Correlation of the Modulation Period and the Phase Formation in Multilayer Eutectic Al/Cu Foils.

Autor: Polishchuk, S., Ustinov, A., Matvienko, Ya., Demchenkov, S., Skoryk, M., Zahorulko, I., Molebny, O., Kotko, A.
Předmět:
Zdroj: Metallophysics & Advanced Technologies / Metallofizika i Novejsie Tehnologii; Oct2024, Vol. 46 Issue 10, p1007-1030, 24p
Abstrakt: Multilayer Al/Cu foils have a high potential to be used as filler materials for diffusion welding or friction stir welding of difficult-to-weld materials. In this work, we study EB-PVD-deposited multilayer Al/Cu foils with the modulation periods (sum thickness of one Al layer and one Cu layer) of 50 nm and 1000 nm. The total composition for both the foils is of about Al--30 wt.% Cu and the total thickness is varied from 20 µm to 30 µm. The phase formations within the foils during heating up to 500°C are investigated by x-ray diffractometry, scanning and transmission electron microscopies, differential scanning calorimetry, and electrical-resistance measurement. The correlation between the modulation period and the formation of the Al2Cu, AlCu3, and Al4Cu9 phases is studied. The sequence, temperatures, and kinetics of phase transformations, as well as the heat of the reactions, are found to correlate significantly with the modulation period. Mechanisms of the phase formations within the foils and their mechanical properties are discussed. [ABSTRACT FROM AUTHOR]
Databáze: Complementary Index