Obtaining and Thermophysical Properties of Thermal Liners Based on Silicone Elastomer Filled with Hexagonal Boron Nitride.

Autor: Romanov, N. S., Danilov, E. A., Gurova, E. M., Grishukhina, E. A.
Zdroj: Journal of Engineering Physics & Thermophysics; Nov2024, Vol. 97 Issue 6, p1605-1612, 8p
Abstrakt: Basic thermophysical and electric-insulation properties of composite film materials based on silicone and hexagonal boron nitride with a content of the heat-conductive filler as high as 46 vol.% have been described. The maximum thermal conductivity was 6 W/(m·K) at a thermal-conductivity anisotropy of about 2.0. The obtained materials possessed a high bulk electrical resistance at a constant current of >109 Ω·cm. It has been shown that in the target interval of operating conditions, the thermal diffusivity of a material at different contents of the filler depends weakly on temperature, and the thermal decomposition of the binder begins at a temperature no lower than 400°C. It has been established that the cross-linking of silicone under pressure may noticeably (up to 20%) increase the composite's thermal conductivity and its anisotropy. [ABSTRACT FROM AUTHOR]
Databáze: Complementary Index
Externí odkaz: