Effect of temperature profile and chemical composition of the flux on void formation in solder joints: in-depth analysis.
| Autor: | Kozak, Martin, Vesely, Petr, Pilnaj, Dominik, Uricar, Jonas, Dusek, Karel |
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| Zdroj: | Welding in the World; Dec2024, Vol. 68 Issue 12, p3195-3204, 10p |
| Databáze: | Complementary Index |
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