Physical design and assembly process development of a multichip package containing a light...

Autor: Bonda, N. Rao, Fang, Treliant, Kaskoun, Kenneth, Lytle, William H., Marlin, Bill, Stafford, John W., Tam, Gordon
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Zdroj: IEEE Transactions on Components, Packaging & Manufacturing Technology, Part B; Nov97, Vol. 20 Issue 4, p389, 7p, 18 Black and White Photographs, 5 Diagrams
Abstrakt: Presents the physical design concept and process developments to construct a small module containing a chip with an array of miniature light emitting diodes as well as the driver control circuitry for the LED array. Composition of the module; Inforamtion on the implementation of the module concept.
Databáze: Complementary Index