| Autor: |
Prades, J. D., Meierhofer, F., Diéguez, A., Waag, A. |
| Předmět: |
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| Zdroj: |
Applied Physics Letters; 10/7/2024, Vol. 125 Issue 15, p1-11, 11p |
| Abstrakt: |
MicroLEDs, particularly when integrated with CMOS microelectronics, represent a significant advancement in nitride technology. While large-area, high-power LEDs for solid-state lighting have seen extensive optimization, microLEDs present unique fabrication and characterization challenges. Utilizing standard CMOS design and foundry services for silicon driver electronics, a new hybrid interconnect technology must be developed for chip–chip or wafer–wafer integration, necessitating much higher lateral resolution than current bonding technologies. Beyond display technology, microLED integration opens avenues for groundbreaking applications such as highly efficient nanosensors, miniaturized optical neuromorphic networks, and robust chip-based microscopy. This paper explores recent advancements in nitride/CMOS hybrid modules, providing an overview of current technologies and future possibilities in this dynamic field. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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