| Abstrakt: |
This document is a summary of selected papers from the 49th International Symposium for Testing and Failure Analysis (ISTFA) in 2023, which focused on electronic device failure analysis, testing, and nondestructive evaluation of power electronics built using silicon carbide (SiC) and gallium nitride (GaN) materials. The special issue of the Journal of Failure Analysis and Prevention (JFAP) was organized by Dr. Vincent Immler and Dr. Navid Asadi. The papers discuss various topics including fault localization, nondestructive imaging techniques, corrosion prevention, and less familiar techniques such as 3D x-ray imaging and time domain reflectometry. The hope is that readers will find these articles interesting and educational, and that the techniques described may spark new ideas or applications in both electronic device failure analysis and bulk system failure analysis. [Extracted from the article] |
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