Gasb-to-Si Direct Wafer Bonding and Thermal Budget Considerations for Photonic Applications.
| Autor: | Anderson, Evan M., Wood, Michael G., Friedman, Tom A., Arterburn, Shawn C., Martinez, William M., Reyna, Robert, Gutierrez, Jordan E., Meyerson, Melissa L, Harris, Christian A., Kotula, Paul G, Cummings, Damion P., Bahr, Matthew, Patel, Victor J., Muhowski, Aaron J., Hawkins, Samuel D., Long, Chris M., Klem, John F., Shank, Joshua C. |
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| Zdroj: | ECS Meeting Abstracts; 2024, Vol. MA2024-01 Issue 1, p1509-1509, 1p |
| Databáze: | Complementary Index |
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