微硅粉制备充填胶凝材料研究现状.

Autor: 刘 增, 孙 伟, 张攀科, 张盛友, 樊 锴, 姜明归
Zdroj: Industrial Minerals & Processing / Huagong Kuangwu yu Jiagong; 2024, Vol. 45 Issue 8, p40-50, 11p
Databáze: Complementary Index