| Autor: |
Qin, Laixiang, Tian, He, Li, Chunlai, Xie, Ziang, Wei, Yiqun, Li, Yi, He, Jin, Yue, Yutao, Ren, Tian‐Ling |
| Předmět: |
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| Zdroj: |
Advanced Electronic Materials; Aug2024, Vol. 10 Issue 8, p1-20, 20p |
| Abstrakt: |
With field effect transistor (FET) sustained to downscale to sub‐10 nm nodes, performance degradation originates from short channel effects (SCEs) degradation and power consumption increment attributed to inhibition of supply voltage (VDD) scaling down proportionally caused by thermionic limit subthreshold swing (SS) (60 mV dec−1) pose substantial challenges for today's semiconductor industry. To further sustain the Moore's law life, incorporation of new device concepts or new materials are imperative. 2D materials are predicted to be able to combat SCEs by virtue of high carrier mobility maintainability regardless of thickness thinning down, dangling bonds free surface and atomic thickness, which contributes to super gate electrostatic controllability. To overcome increasing power dissipation problem, new device structures including negative capacitance FET (NCFET), tunnel FET (TFET), dirac source FET (DSFET) and the like, which show superiority in decreasing VDD by lowering SS below thermionic limit of 60 mV dec−1 have been brought out. The combination of 2D materials and ultralow steep slope device structures holds great promise for low power‐dissipation electronics, which encompass both suppressed SCEs and reduced VDD simultaneously, leading to improved device performance and lowered power dissipation. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
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