| Autor: |
Vanitha, C., Kaushik, Baro, Sashank, C. |
| Předmět: |
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| Zdroj: |
Journal of Materials Engineering & Performance; Jun2024, Vol. 33 Issue 11, p5306-5318, 13p |
| Abstrakt: |
Cu-1.5 wt.% Zn alloy used in the present study was subjected to the hot impression creep tests at three stresses of 75, 110 and 150 MPa and three temperatures of 250, 300 and 350 °C for a constant dwell time of 2 h. The effect of stress and temperature on the impression depth with respect to time was studied. Irrespective of the test condition, the depth of impression increased with respect to the time. However, upon increasing the applied stress, the twins were observed. Stress exponent values and activation energies were determined for different test temperatures and stresses. Stress exponent values related to the plastic flow over the complete range of experimental conditions were found to lie between 4 and 5.5. Whereas the average activation energy value was determined to be 164 ± 10 kJ/mol. Calculated stress exponents and activation energy values reveal the dislocation climb phenomenon, controlled by dislocation pipe diffusion as the mechanism of the creep. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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