Technological Process of Assembly and QA Testing of Silicone Tracking Modules with Silicon Strip Sensor.

Autor: Sheremetev, A. D., Leontiev, V. V., Dementev, D. V., Shitenkov, M. O., Murin, Yu. A.
Zdroj: Physics of Particles & Nuclei Letters; Jun2024, Vol. 21 Issue 3, p466-480, 15p
Abstrakt: The key technological stages of assembly of silicone tracking modules with silicon strip sensors for use in the wide-aperture silicon tracking system of the BM@N experiment are considered. Methods for finding the optimal parameters for the ultrasonic linear automatic welding of aluminum microcables with a silicon sensor are described. The methodology and results of intermediate QA testing during the assembly of the silicone tracking module are presented. The method of mounting unpackaged microcircuits on a board is described. The results of the preproduction assembly of silicone tracking modules are presented. [ABSTRACT FROM AUTHOR]
Databáze: Complementary Index