| Autor: |
SHEA, CHRYS, CARBONI, DEBBIE, HANERHOFF, JOHN |
| Předmět: |
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| Zdroj: |
Printed Circuit Design & Fab: Circuits Assembly; May2024, Vol. 41 Issue 5, p59-75, 17p |
| Abstrakt: |
This article examines the effectiveness of different stencil coatings and underwipe solvents on 0.4mm BGA packages. The practice of periodically wiping excess solder paste off the stencil during the printing process is crucial for maintaining print quality. The study found that coated stencils and wet wipes improve transfer efficiency and reduce variation in print quality. The article also discusses the leading-edge effect observed in solder paste printing. Overall, wet wiping is recommended to enhance print performance and prevent defects in the assembly process. [Extracted from the article] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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