| Autor: |
Park, Hyun, Kim, Sung-Jin, Song, Yu-jin, Shin, Han-Kyun, Jeon, Jong-Bae, Kim, Sung-Dae, Kim, Jung-Han, Lee, Hyo-Jong |
| Zdroj: |
Metals & Materials International; May2024, Vol. 30 Issue 5, p1430-1439, 10p |
| Abstrakt: |
We investigated an electrodeposition technique for fabricating a high-strength thin metallic foil as a current collector material in secondary batteries. To increase the strength and minimize the increase in electrical resistivity, copper–nickel (Cu–Ni) double-layered foils were considered and the grain structures of each layer were manipulated by controlling the electrodeposition solution and process conditions. Initially, a Cu electrodeposition process was developed to form a bamboo-like grain structure after annealing, which was followed by two Ni processes to produce a foil with a columnar or nano-crystalline grain structure. Subsequently, several foils were annealed at 190 °C for 10 min considering that current collectors experience a thermal load during battery manufacturing. Scanning and transmission electron microscopy-based crystallographic orientation mapping techniques indicated a remarkable change in the grain structure of the Cu foil owing to the grain growth after annealing; conversely, the Ni foil with the nano-crystalline grain structure was insensitive to annealing. By applying these processes to each material, four 10-µm-thick double-layered foils were fabricated. Among these foils, the foil with a nano-crystalline Ni layer exhibited the smallest change in material properties resulting in the highest tensile strength and moderate elongation after annealing. The tensile strength of the best double-layered foil was approximately three-fold higher than that of the single-layered Cu foil after annealing. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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