The damage mechanism in copper studied using in situ TEM nanoindentation.
| Autor: | Dong Wang, Zhenyu Zhang, Dongdong Liu, Xingqiao Deng, Chunjing Shi, Yang Gu, Xiuqing Liu, Xiaoyu Liu, Wei Wen |
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| Zdroj: | Nanoscale Advances; 4/21/2024, Vol. 6 Issue 8, p2002-2012, 11p |
| Databáze: | Complementary Index |
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