| Abstrakt: |
The document titled "DEVICE PACKAGING 2024" provides a schedule or program for a conference or event related to microelectronics and device packaging. It includes a list of professional development courses (PDCs) led by industry leaders, keynote sessions, technical sessions, and a member's event organized by 3D InCites. The topics covered in the PDCs and technical sessions range from fan-out wafer level packaging to chiplet design and 5G/6G/mmWave materials. The document also lists posters and presentations on various topics such as secure track and trace in microelectronics, thermal optimization of embedded MOSFET, and 2.5D/3D packaging market trends. [Extracted from the article] |
