| Autor: |
Wang, Pengfei, Wu, Yifan, Li, Jianfeng, Liang, Ming |
| Předmět: |
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| Zdroj: |
Journal of Materials Engineering & Performance; Mar2024, Vol. 33 Issue 6, p2607-2615, 9p |
| Abstrakt: |
In this paper, two types of high strength and high conductivity Cu-Nb and Cu-Nb-Cu microcomposites wires were successfully fabricated by accumulative drawing and bundling process. The results demonstrated that the comprehensive performance of the Cu-Nb-Cu microcomposite was considerably higher than that of the Cu-Nb microcomposite. The effects of reinforcement morphology (Nb phase) on the diffraction peaks, microstructures, and mechanical and electrical properties were studied in detail. We rationalized the high strength is attributed to grain refinement, dislocation strengthening, as well as fiber composite strengthening, which will provide conductor material supports for the pulsed high magnetic fields. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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