Termite and decay resistance of three Sorghum (Sorghum bicolor) accessions particleboard bonded with maleic acid adhesive.

Autor: Sutiawan, Jajang, Hermawan, Dede, Hadi, Yusuf Sudo, Nawawi, Deded Sarip, Kusumah, Sukma Surya, Zulfiana, Deni, Pramasari, Dwi Ajias
Předmět:
Zdroj: AIP Conference Proceedings; 2024, Vol. 2973 Issue 1, p1-7, 7p
Abstrakt: In prior studies, three-accession sorghum was employed as a substitute raw material to make particleboard with maleic acid adhesive. Maleic acid (MA) performed better than phenol-formaldehyde (PF) adhesive regarding the bonded particleboard's physical properties. Furthermore, the MA-bonded particleboard was equivalent to those that were citric acid-bonded. However, termite and decay resistance at various sorghum accession is unknown. Therefore, this study looked at how sorghum accessions affected the particleboard's resilience to termites and decay. Three sorghum accessions 4183A, Super 1, and Pahat had to be used in the production of particleboard. Particleboard manufacturers employed the 20 % MA adhesive. The board's dimensions were 30 by 30 by 0.9 cm3, and the desired density was 0.8 g/cm3. For 10 minutes at 200 °C, the particle mat was compressed at a maximum pressure of 6.5 MPa. In order to test for termite resistance, SNI 7207-2014 was used, while JIS K 1571-2004 evaluated the particleboard's decay resistance. The weight loss of particleboard against a termite attack in this study ranged from 13.87-47.21%. Particleboard that was MA-bonded against termite attack lost less weight than the control. In addition, control samples had a higher weight loss (42.16-44.60%) than particleboard bonded with MA (11.06-12.39%) after 12 weeks of brown rot and white-rot fungi. The higher acidity of MA and the lower moisture content of the particleboard are likely to blame for the improved resistance to decomposition. Due to the similar chemical composition of the three sorghum accessions, the sorghum accession had no discernible impact on termite and decay resistance. [ABSTRACT FROM AUTHOR]
Databáze: Complementary Index