| Autor: |
Du, Yuan-Kai, Shi, Zheng-Xue, Dong, Shan, Jin, Hui, Ke, Xue, Zhao, Pei, Jiang, Bing-Bing, You, Feng |
| Předmět: |
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| Zdroj: |
Chinese Journal of Polymer Science (Springer Science & Business Media B.V.); Mar2024, Vol. 42 Issue 3, p277-291, 15p |
| Abstrakt: |
In recent years, the demand direction for electronic equipment has expanded into embedded and miniaturized devices. The heat radiation problem has become one of the most significant factors for hindering the development of electronic devices. Since heat radiation material is one of the important components in electronic devices, the demand for enhancing thermal conductivity is also increasingly urgent. Research on thermal conductive polymer composites has become a major direction for developing functional composites. This work reviewed the recent progress in the fabrication of thermal conductive polymer composites. Five different structures are presented, including the using of single fillers, hybrid fillers, double threshold percolation structure, segregated structure and other complex multiphase structures. Specifically, the preparation of high-performance thermal conductive polymer composites was introduced through the combination of various thermal conductive fillers. Finally, the development direction of high thermal conductive polymer composites was briefly explored. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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