| Autor: |
Tao, Kangkang, Sun, Gaohui, Zhang, Shuai, Wang, Jun, Chen, Rongrong, Han, Shihui |
| Předmět: |
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| Zdroj: |
Macromolecular Rapid Communications; Feb2024, Vol. 45 Issue 3, p1-10, 10p |
| Abstrakt: |
Polyimide (PI) film with hydrophilic greatly limits their application in the field of microelectronic device packaging. A novel hydrophobic PI film with sag structure and improved mechanical properties is prepared relying on the reaction between anhydride‐terminated isocyanate‐based polyimide (PIY) containing a seven‐membered ring structure and the amino‐terminated polyamide acid (PAA) via multi‐hybrid strategy, this work named it as hybrid PI film and marked it as PI‐PIY‐X. PI‐PIY‐30 showed excellent hydrophobic properties, and the water contact angle could reach to 102°, which is 20% and 55% higher than simply PI film and PIY film, respectively. The water absorption is only 1.02%, with a decrease of 49% and 53% compared with PI and PIY. Due to that the degradation of seven‐membered ring and generation of carbon dioxide led to the formation of sag structure, the size of sag structures is ≈16.84 and 534.55 nm for in‐plane and out‐plane direction, which are observed on surface of PI‐PIY‐30. Meanwhile, PI‐PIY‐30 possessed improved mechanical properties, and the tensile strength is 109.08 MPa, with 5% and more than 56% higher than that of pure PI and PIY film, showing greatly application prospects in the field of integrated circuit. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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