(Invited) Hybrid Bonding for 3D Applications: Improvements and Limitations.

Autor: Deloffre, Emilie, Ayoub, Bassel, Lhostis, Sandrine, Dettoni, Florent, Fournel, Frank, Montméat, Pierre, Mermoz, Sebastien
Zdroj: ECS Meeting Abstracts; 2023, Vol. MA2023-02 Issue 1, p1592-1592, 1p
Databáze: Complementary Index