(Invited) Bonding Strength of Cu-Cu Hybrid Bonding for 3D Integration Process.
| Autor: | Fujii, Nobutoshi, Furuse, Shunsuke, Yoshioka, Hirotaka, Ogawa, Naoki, Yamada, Taichi, Hirano, Takaaki, Saito, Suguru, Hagimoto, Yoshiya, Iwamoto, Hayato |
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| Zdroj: | ECS Meeting Abstracts; 2023, Vol. MA2023-02 Issue 1, p1583-1583, 1p |
| Databáze: | Complementary Index |
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