Nanoporous Cu-Sn Intermetallic Material for Interconnects in Electronic Packaging.
| Autor: | Dimitrov, Nikolay, Castillo, Ezer, Njuki, Michael, Pasha, Abdullah Faisal |
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| Zdroj: | ECS Meeting Abstracts; 2023, Vol. MA2023-02 Issue 1, p1279-1279, 1p |
| Databáze: | Complementary Index |
| Externí odkaz: |
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