| Autor: |
Jiang, Meng, Liu, Yang, Li, Ke, Pan, Zhen, Sun, Quan, Xu, Yongzhe, Tao, Yuan |
| Předmět: |
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| Zdroj: |
Soldering & Surface Mount Technology; 2024, Vol. 36 Issue 1, p1-7, 7p |
| Abstrakt: |
Purpose: The purpose of this paper is to study the reliability of sintered nano-silver joints on bare copper substrates during high-temperature storage (HTS). Design/methodology/approach: In this study, HTS at 250 °C was carried out to investigate the reliability of nano-silver sintered joints. Combining the evolution of the microstructure and shear strength of the joints, the degradation mechanisms of joints performance were characterized. Findings: The results indicated that the degradation of the shear properties of sintered nano-silver joints on copper substrates was attributed to copper oxidation at the silver/copper interface and interdiffusion of interfacial elements. The joints decreased by approximately 57.4% compared to the original joints after aging for 500 h. In addition, severe coarsening of the silver structure was also an important cause for joints failure during HTS. Originality/value: This paper provides a comparison of quantitative and mechanistic evaluation of sintered silver joints on bare copper substrates during HTS, which is of great importance in promoting the development of sintered silver technology. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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