| Autor: |
Vasiliev, L. L., Zhuravlyov, A. S., Kuz′mich, M. A., Kulikovskii, V. K., Olekhnovich, V. A. |
| Předmět: |
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| Zdroj: |
Journal of Engineering Physics & Thermophysics; Nov2023, Vol. 96 Issue 7, p1708-1715, 8p |
| Abstrakt: |
The thermal properties of a loop thermosyphon made of copper with a horizontally located evaporator, covered by a porous coating, and a condenser intended for cooling powerful electronic devices and transferring heat fluxes with a power of 1 kW and above have been studied. The characteristics of thermosyphon evaporators having capillary structures and liquid- and air-cooled condensers of various types were studied experimentally. It is shown that coating the capillary grooves by a thin layer of sintered powder makes it possible to more than halve the thermal resistance of the thermosyphon evaporator and that, with a condenser cooled by air, the total thermal resistance of the device does not exceed 0.1°C/W. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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