CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5D, and 3D Processor-Memory Systems.
| Autor: | SIDDHU, LOKESH, KEDIA, RAJESH, PANDEY, SHAILJA, RAPP, MARTIN, PATHANIA, ANUJ, HENKEL, JÖRG, PANDA, PREETI RANJAN |
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| Zdroj: | ACM Transactions on Architecture & Code Optimization; Sep2022, Vol. 19 Issue 3, p1-25, 25p |
| Databáze: | Complementary Index |
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