| Autor: |
Zin, Moe Ei Ei, Sutapun, Wimonlak |
| Předmět: |
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| Zdroj: |
AIP Conference Proceedings; 2023, Vol. 2884 Issue 1, p1-5, 5p |
| Abstrakt: |
Silver nanoparticles (AgNPs) are widely used as antimicrobial agent in food packaging applications, wound dressing materials and other antimicrobial applications because of their outstanding antimicrobial activity. AgNPs deposited onto calcium carbonate (CaCO3) particles, have also the antimicrobial activity of which calcium carbonate functions as the agent carrier. Silver nanoparticles loaded calcium carbonate particles (Ag/CaCO3) were prepared by in situ precipitation method as mentioned by S. Zapotoczny (2012). In this study, antimicrobial composite material from the silver loaded calcium carbonate and poly (L-lactic acid) (PLA) is prepared with electrospinning technique. The Hildebrand solubility parameter of PLA is around 10.1 cal1/2 cm −3/2 (20 to 21 MPa½). PLA solution is prepared using binary solvent systems with the solubility parameters close to that of PLA, binary solvent system of chloroform (CHL): dimethylformamide (DMF) and dichloromethane (DCM): dimethylformamide (DMF) with the mixing ration of 9:1 by volume. Then, the PLA solutions and the filler were mixed in order to prepare electrospun nanofiber mat. The condition for fabricating electrospun PLA and Ag/CaCO3-PLA is a 15 cm of collection distance and 15 kV of applied voltage. The effect of binary solvent system on fibers morphology and diameter will be studied using the Field Emission Scanning Electron Microscope (FE-SEM). In addition, tensile properties of the mat will be determined using Universal Testing Machine (UTM). Incorporation of 5% Ag/eCaCO3 filler and use of solvent system of DCM:DMF gave rise to filled PLA electrospun fibers with larger diameter fiber with bead on the string along the fiber. For tensile properties, PLA electrospun fibers with 5% Ag/eCaCO3 from solvent system of DCM:DMF have higher Young's modulus and tensile strength than the one prepared from solvent system of CHL:DMF. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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