| Abstrakt: |
Purpose: The purpose of this study to investigate the organized porous network zinc (OPNZ) scaffolds. Their mechanical characteristics, surface roughness and fracture mechanism were assessed in relation to their structural properties. The prospects of fused deposition modeling (FDM) for printing metal scaffolds via rapid tooling have also been studied. Design/methodology/approach: Zn scaffolds with different pore and strut sizes were manufactured via the rapid tooling method. This method is a multistep process that begins with the 3D printing of a polymer template. Later, a paraffin template was obtained from the prepared polymer template. Finally, this paraffin template was used to fabricate the Zn scaffold using microwave sintering. The characterization of prepared Zn samples involved structural characterization, microstructural study, surface roughness testing and compression testing. Moreover, based on the Gibson–Ashby model analysis, the model equations' constant values were evaluated, which can help in predicting the mechanical properties of Zn scaffolds. Findings: The scanning electron microscopy study confirmed that the fabricated sample pores were open and interconnected. The X-ray diffraction analysis revealed that the Zn scaffold contained hexagonal closed-packed Zn peaks related to the a-Zn phase, validating that scaffolds were free from contamination and impurity. The range for ultimate compressive strength, compressive modulus and plateau stresses for Zn samples were found to be 6.75–39 MPa, 0.14–3.51 GPa and 1.85–12.6 MPa by adjusting their porosity, which are comparable with the cancellous bones. The average roughness value for the Zn scaffolds was found to be 1.86 µm. Originality/value: This research work can widen the scope for extrusion-based FDM printers for fabricating biocompatible and biodegradable metal Zn scaffolds. This study also revealed the effects of scaffold structural properties like porosity, pore and strut size effect on their mechanical characteristics in view of tissue engineering applications. [ABSTRACT FROM AUTHOR] |
