EUV mask defect inspection for the 3nm technology node.

Autor: Hermans, Yannick, Heil, Tilmann, Capelli, Renzo, Szafranek, Bartholomaeus, Rhinow, Daniel, Mette, Gerson, Salg, Patrick, Hermanns, Christian Felix, Dey, Bappaditya, Halipre, Luc, Trivkovic, Darko, Rincon Delgadillo, Paulina, Marschner, Thomas, Halder, Sandip
Zdroj: Proceedings of SPIE; 2/9/2024, Vol. 12802, p128020H-128020H-10, 1p
Databáze: Complementary Index