| Autor: |
Cho, Jeong Ho, Lim, Jung Ah, Han, Joong Tark, Jang, Ho Won, Lee, Jong-Lam, Cho, Kilwon |
| Předmět: |
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| Zdroj: |
Applied Physics Letters; 4/25/2005, Vol. 86 Issue 17, p171906, 3p, 1 Diagram, 3 Graphs |
| Abstrakt: |
With the aim of improving the electrical and adhesion properties of a noble-metal electrode (Ag)/organic interface, a SH-terminated self-assembled monolayer (SAM) that reacts with the silver atoms of the electrode was tested. Silver atoms deposited on the SH-modified surface were found to bind strongly to the terminal sulfur atoms as a result of the reaction between sulfur and silver. In contrast, silver atoms deposited onto a CH3-modified surface do not react with the SAM. The specific contact resistance of the interface between the SH-terminated surface and the silver electrode (1.31×10-2 Ω cm2) was found to be much lower than that of the silver thin film deposited on the CH3-modified surface (495.58 Ω cm2). [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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