| Autor: |
Kozhevnikova, Yu. M., Tolmacheva, I. G., Borisov, V. N., Zaikovskaya, O. N., Iskhuzhin, R. R., Agafonova, A. F., Belobrova, I. A. |
| Zdroj: |
Polymer Science -- Series D; Sep2023, Vol. 16 Issue 3, p751-757, 7p |
| Abstrakt: |
This paper presents the results of a complex thermoanalytical study of K-800 organosilicon adhesive. The temperatures of curing of the adhesive composition, evaporation of the reaction products, and the onset of thermal degradation have been determined. Correlation and comparison of research results obtained by different methods has been carried out. It is shown that the results of complex thermal analytical studies can be used as the basis for assessing the quality of the adhesive joint. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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