75‐4: Research on Surface Protective Layer of Cu Pad to Improve Welding Capability for MLED.
| Autor: | Hu, Haifeng, Zeng, Ting, Yang, Caigui, Zhang, Renwei, Liu, Xiaoxiao, Xu, Zouming, Sun, Haiwei, Shi, Lingyun, Chen, Ming |
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| Zdroj: | SID Symposium Digest of Technical Papers; Jun2023, Vol. 54 Issue 1, p1068-1071, 4p |
| Abstrakt: | In this paper, by adding Cu alloy or Ni‐Au layer to Cu pad surface reduced the occurrence of pseudo welding and improve the rework strength and promoted the product stability and reliability. [ABSTRACT FROM AUTHOR] |
| Databáze: | Complementary Index |
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