Autor: |
Neelova, O. V., Kubalova, L. M., Panova, T. A., Bekmurzova, A. S. |
Zdroj: |
Polymer Science -- Series D; Jun2023, Vol. 16 Issue 2, p345-352, 8p |
Abstrakt: |
A one-component organosilicon composition based on a Lestosil SM-NT block copolymer solution containing an optimal ratio of linear polydimethylsiloxane and ladder phenylsilsesquioxane units in an organic solvent was developed. A heterosiloxane solution containing boron and zirconium atoms in alkoxysilane in the siloxane chain and special additives that increase the operational properties of coatings was used as a curing system. The composition is to be used to obtain heat-resistant electrically insulating and moisture-resistant coatings with improved physical and chemical properties for use as protective materials in microelectronics and electronic devices. [ABSTRACT FROM AUTHOR] |
Databáze: |
Complementary Index |
Externí odkaz: |
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