Built-In Packaging for Two-Terminal Devices.

Autor: Gulsaran, Ahmet, Bastug Azer, Bersu, Ozyigit, Dogu, Saritas, Resul, Kocer, Samed, Abdel-Rahman, Eihab, Yavuz, Mustafa
Předmět:
Zdroj: Micromachines; Jul2023, Vol. 14 Issue 7, p1473, 12p
Abstrakt: Conventional packaging and interconnection methods for two-terminal devices, e.g., diodes often involve expensive and bulky equipment, introduce parasitic effects and have reliability issues. In this study, we propose a built-in packaging method and evaluate its performance compared to probing and wire bonding methods. The built-in packaging approach offers a larger overlap area, improved contact resistance, and direct connection to testing equipment. The experimental results demonstrate a 12% increase in current, an 11% reduction in resistance, and improved performance of the diode. The proposed method is promising for enhancing sensing applications, wireless power transmission, energy harvesting, and solar rectennas. Overall, the built-in packaging method offers a simpler, cheaper, more compact and more reliable packaging solution, paving the way for more efficient and advanced technologies in these domains. [ABSTRACT FROM AUTHOR]
Databáze: Complementary Index
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