| Autor: |
Satrijo, Djoeli, Kurdi, Ojo, Rusnaldy, Yulianti, Ian, Putra, Faraz Janatra Andriansyah |
| Předmět: |
|
| Zdroj: |
AIP Conference Proceedings; 2023, Vol. 2614 Issue 1, p1-7, 7p |
| Abstrakt: |
Currently, global demand of optical sensors continues to thrive due to human need for fast and reliable networks. For this reason, optical sensors such as waveguide continue to be optimized in every aspect, one of which is in its mechanical properties, such as resistance to pressure etc. Stress and strain experienced by waveguide is one of the causes of failure in the transmission of light in waveguide. Many research carried out the stress and strain of waveguide but rarely considers the effect of adhesive to waveguide. The purpose of this study is to find the most optimum adhesive properties based on its effect on the stress and strain on the waveguide with cores in the form of Polymethyl Methacrylate (PMMA) and silicone rubber as part of its cladding. This study used ABAQUS 2017 software to simulate waveguide conditions with epoxy-based adhesive variations, each variation Tra-Con F113, Epotek 301-2 and Hysol 9361 are further simulated into spring elements as core interface and cladding models with adhesive spring constants of 5330 N/mm, 12.300 N/mm and 18.320 N/mm. Models are pressured 20, 40, 60, 80 and 100 MPa. Each model is then researched, and the results are recorded. Based on the data, the most optimum adhesive is Hysol 9361 with an adhesive spring coefficient of 18.320 N/mm at maximum pressure conditions resulting in the highest safety factor of 1.11 and the smallest strain of 0.07. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
|
