Heterogeneous Chiplet Design and Integration Bringing a New Twist to SiP Design.

Autor:	Felton, Keith, Mastroianni, Anthony, Rinebold, Kevin, Viklund, Per
Předmět:	SYSTEMS on a chip WAFER level packaging PRINTED circuit design
Zdroj:	Advancing Microelectronics; Mar/Apr2022, Vol. 49 Issue 2, p10-14, 5p
Databáze:	Complementary Index
Externí odkaz:	Zobrazit plný text záznamu