FCBGA 封装的CPU 芯片散热性能影响因素研究.

Autor: 陈 彪, 陈 才, 张 坤, 叶 琴
Zdroj: Computer Engineering & Science / Jisuanji Gongcheng yu Kexue; Mar2023, Vol. 45 Issue 3, p406-410, 5p
Databáze: Complementary Index