Autor: |
Mie Tohnishi, Mina Sato, Akihiro Matsutani, Takashi Ubukata, Sachiko Matsushita |
Předmět: |
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Zdroj: |
Sensors & Materials; 2023, Vol. 35 Issue 3, Part 3, p1023-1033, 11p |
Abstrakt: |
We demonstrated the surface treatment of polyimide using solid-source H2O plasma for the fabrication of Ge thin films as an electrode of flexible devices. By using the solid-source H2O plasma, the internal stress of a polyimide sheet with deposited Ge was decreased, and the adhesion between the polyimide and Ge was also improved. In addition, the solid-source H2O plasma treatment was effective for increasing the bending durability and decreasing the resistance of the Ge electrode on a polyimide surface. Moreover, we analyzed a polyimide surface treated with solid-source H2O plasma, by Fourier transform IR spectroscopy and X-ray photoelectron spectroscopy. We believe that the proposed solid-source H2O plasma process is useful for bonding between polyimide and Ge in the fabrication of flexible semiconductor electrodes. [ABSTRACT FROM AUTHOR] |
Databáze: |
Complementary Index |
Externí odkaz: |
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