Ultra‐High Interfacial Thermal Conductance via Double hBN Encapsulation for Efficient Thermal Management of 2D Electronics.

Autor: Ye, Fan, Liu, Qingchang, Xu, Baoxing, Feng, Philip X.‐L., Zhang, Xian
Zdroj: Small; 3/22/2023, Vol. 19 Issue 12, p1-11, 11p
Databáze: Complementary Index
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