| Autor: |
Niazi, Parisa, Javanbakht, Mahdi, Karevan, Mehdi, Tavakoli, Mohammad Reza |
| Předmět: |
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| Zdroj: |
Polymer Bulletin; Apr2023, Vol. 80 Issue 4, p4387-4406, 20p |
| Abstrakt: |
In this paper, hollow glass microspheres (HGMs) are used as fillers to improve the thermal properties of polyester resin. The thermal conductivity coefficient is obtained from experiment and numerical simulations and their results are compared. The thermal conductivity coefficient is measured using KD2 Pro which shows that the thermal conductivity coefficient decreases as the HGM weight fraction increases. For numerical simulations, the HGM sizes are obtained for different weight fractions based on the SEM images, Image J software and the histogram diagram. The RVEs are produced in Digimat and exported into COMSOL Code where the heat transfer problem is solved and the thermal conductivity coefficient is calculated. The HGM size and distribution show no practical effect on the conductivity coefficient. The results of temperature dependent and independent heat capacities and thermal conductivity coefficient are compared which show that the thermal conductivity coefficient using the constant specific heat capacity and thermal conductivity coefficient of matrix shows a better agreement with the experiment. Using the Cooperative rearranging region (CRR) estimate, the interphase width is calculated and added to the model which results show no difference with those without the interphase since its width is much smaller than the HGM size. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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