| Autor: |
Klinkov, S. V., Kosarev, V. F., Shikalov, V. S. |
| Předmět: |
|
| Zdroj: |
AIP Conference Proceedings; 2023, Vol. 2504 Issue 1, p1-5, 5p |
| Abstrakt: |
Using the developed model, the surface temperature of aluminum substrate of different thicknesses is calculated under the conditions when the nozzle moves parallel to the substrate plane at different speeds. It is shown that (when other conditions being equal) the substrate temperature in the deposition spot decreases with increasing substrate thickness. This circumstance allows distinguishing the effect of the influence of substrate surface temperature on the activation stage during cold spraying. Experiments on the deposition of copper coatings on aluminum substrates of different thicknesses have been carried out. The obtained results allow concluding that the substrate surface temperature (within its change of about 100 K) has almost no effect on the activation stage during cold spraying. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
|
