Study of the Influence of Mechanical and Temperature Effects on the Level of Stresses and Deformations in 3D Microassemblies Hermetically Sealed with Two Types of Compounds.

Autor: Vertyanov, D. V., Belyakov, I. A., Pogudkin, A. V., Timoshenkov, S. P., Sidorenko, V. N.
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Zdroj: Russian Microelectronics; Dec2022, Vol. 51 Issue 7, p531-538, 8p
Abstrakt: Epoxy molded compounds (EMCs) containing a high percentage of filler in the form of silicon oxide particles are used to reduce the difference in the temperature coefficient of linear expansion between the die and the sealing material when dies packaging in plastic. However, in addition to the die, the commutation substrate has a significant effect on the level of thermomechanical stresses in the package. In the 3D integration in a microassembly, vertical interconnects combines several substrates that can be made from different dielectrics. This paper shows that sealing materials with different temperature coefficients of linear expansion in the outer and inner parts of the product can reduce the level of thermal stresses in such a structure. The dependences of the thermomechanical stress and deformation of the microassembly on the number of levels and the amount of filler in the outer sealing compound are determined. The study is carried out by the computer simulation of various designs of microassemblies sealed with compounds with different values of the temperature and mechanical parameters. Based on the obtained dependency graphs, the optimal values of the filler content in the outer and inner compounds are established to ensure the minimum temperature and mechanical (under the action of acceleration) deformation of microassemblies at a different number of levels. [ABSTRACT FROM AUTHOR]
Databáze: Complementary Index
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