| Autor: |
Pour, Mohammad Farajollah, Mehdinia, Meysam, Kiamahalleh, Mohammad Valizadeh, Hoseini, Kazem Doost, Hatefnia, Hamid, Dorieh, Ali |
| Předmět: |
|
| Zdroj: |
Wood Material Science & Engineering; Dec2022, Vol. 17 Issue 6, p929-936, 8p |
| Abstrakt: |
The aim of this study was to investigate the biological durability of particleboard, containing silver nanoparticles (Ag-NPs) and copper nanoparticles (Cu-NPs) to Trametes versicolor, white-rot fungus of hardwoods. NPs were mixed and sprayed with applied resin, to cover wood particles volumetrically. Bio-deterioration of specimens was measured through average mass loss after 4–16 weeks of exposure to T. versicolor. The results displayed a significant impact of Ag-NPs and Cu-NPs on the antifungal resistance of particleboard. The highest resistance to fungal attack is experienced by sample containing 15% Ag-NPs with the mass loss of 0.9% for 4 weeks to 3.24% after 16 weeks of exposure to T. versicolor which was classified as a very durable sample. Maximum mass loss of 45.5% was observed for the control specimens after 16 weeks. The presence of Ag-NPs and Cu-NPs on the wood particle surface was verified by the Energy-Dispersive X-ray Spectroscopy. Scanning Electron Microscopy analysis confirmed the uniform distribution of NPs in bondline covered the surface of the wood particles properly, which seems to be an impressive barrier to fungal attack by inhibiting fungal hyphae growth. Because of the high thermal conductivity of metallic NPs, internal bonding properties of particleboard containing NPs were improved. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
|
