| Autor: |
Aithal S., Kiran, Babu N., Ramesh, Chethan K. S., Manjunath H. N., Reddy J., Sudheer, Joshi, Nikhil |
| Předmět: |
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| Zdroj: |
AIP Conference Proceedings; 2022, Vol. 2615 Issue 1, p1-10, 10p |
| Abstrakt: |
Electronic boxes mounted on aircraft, missiles, spacecraft etc. are prone to severe environmental conditions one such being, vibration. Frequency spectrum of such vibrations lies anywhere between 3 Hz to 5000 Hz and acceleration of 1-5 g levels are present. Under such conditions, the performance of the electronics is dependent on the effectiveness of the damping mechanism present. In the present investigation, FE analysis was conducted on printed circuit board of complex board shapes. The analysis shows the response of the board under different conditions and as a marker to opt for the appropriate type of damping mechanism. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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